Bottom emitting 1.3 /spl mu/m BH-FP laser with integrated 45/spl deg/ reflector and monitor photodiode

We realized for the first time by a complete monolithic integration a bottom emitting laser OEIC including laser, monitor photodiode, and prism for SMT-packaging. This approach with the fabrication of the laser and reflection mirrors in full wafer technology exploits additionally the cost efficient advantages of on wafer facet preparation and on-wafer characterization.