Reduction of alignment shift in flip-chip bonding for VSCEL array module packaging

An optimum approach for reduction of alignment shift in flip-chip bonding for vertical cavity surface emitting laser (VSCEL) array module package is presented. The laser array module was fabricated by the assembly of a 4-channel VSCEL array and 50/125 /spl mu/m multimode fiber ribbons. The results show that the alignment shifts of flip-chip bonding under the optimum process of 20 sec bonding time and 20 g loading are minimum. The average minimum misalignments of flip-chip bonding were measured to be 1 and 5 /spl mu/m for horizontal and vertical directions, respectively.