Device processing technology for free-space optical interconnect system

A device processing technology was developed for fabricating arrays of detector/modulator chips used in a free-space optical interconnect system. The arrays are fabricated onto a GaAs/AlGaAs multi quantum well (MQW) epitaxial layer having an in-plane anisotropic strain. The packaged module array consists of a strain inducing substrate onto which the GaAs epitaxial layer is transferred, and bonded to a Si CMOS driver by flip chip technology. The module is attached to a printed circuit board (PCB), and two such boards were mounted into a free space optical interconnect demonstration system.