On the effect of system constraints on mechanical integrity of high density packages used in telecommunication applications

A system level mechanical analysis was performed to optimize the mechanical integrity of a high-density MCM package, employing ball grid array technology, and being used in a telecommunications application. Post manufacturing processes in addition to the system constraints can affect the mechanical integrity of packages already qualified at the component level. The prediction of these large-scale effects and integrating the new insights into the package design guidelines is very important in achieving applications reliability. We have fully analyzed the system behavior of a test structure intended for a high-density telecommunication application. The analysis activities were accelerated using highly integrated internally developed codes, compatible with commercial finite-element-analysis tools. The study included a set of experimental test structures, and a full set of system validation experiments. In this paper, we present the results of this study which proposes a system analysis methodology along with describing the related analysis results, covering the effect of a large set of design parameters effecting the mechanical integrity of the package. These results and methods are being used for design optimization analysis at Mindspeed Technologies Inc.