The needs, evolution, status and challenges of microelectronics packaging education in the US

It is only within the last 10 years that packaging has begun to be viewed as an important discipline. Several universities have started to provide packaging courses as well as special focuses on certificate programs. This paper describes human resource needs in terms of quality and quantity of packaging engineers, the evolution of electronic packaging education at all levels in the US to meet these human resource needs, and discusses how the next generation of microelectronics packaging education should be conducted to meet the needs of US industry.