Characterization of RF/microwave packaging structures

Various RF/microwave packaging structures are investigated by a numerical full wave analysis. In frequency ranges up to 80 GHz chip contacting methods are characterized. Coplanar waveguide-to-coax and -to-microstrip and coax-to-microstrip transitions are treated. Optimization and sensitivity curves are given. The simulation results can be used for introducing some standard RF/microwave packaging structures.