Evaluation of sheet resistance and electrical linewidth measurement techniques for copper damascene interconnect

The effects of the barrier layer and dishing in copper interconnects lead to extra difficulties in measuring sheet resistance (R/sub S/) and linewidth when compared with equivalent measurements on nondamascene tracks. This paper examines these issues and presents the results of simulations that quantify the effects of diffusion barrier layers and dishing on the extraction of R/sub S/ from cross type test structures and the effect this has on linewidth measurement.