Semiconductor Manufacturing Case Studies: Wedge Bonder Characterization via Advanced Process Control (APC)

Advanced Process Control (APC) enables solution to finer levels of control and diagnostics with integration between machines to manufacturing system. Defining of each key-numbers thru mathematics derivation can be crunch by APC Trend Suite using calculated and statistical key-numbers. Case studies of application of this feedback information illustrate that benefits can be achieved from straight-forward applications; however, these benefits can be expanded (especially) as more complex scheduling and control solutions are implemented. Realizing this type of yield-enhanced solution in a cost-effective manner requires manufacturing-wide adherence to standards and best practices for component integration, event-based control system operation, and user interface management. In these manufacturing case studies, hick wire wedge bonder platform was selected as primary case studies for abnormal characterization detection with the help of APC Trend Suite Software. Non-stick on lead (NSOL) defect is well known defect in ball bond or wedge bond process, and the post-mortem effect causing high effort of reverse engineering study. With APC connection, several trace data such as current, deformation and impedance able to be captured and correlated back to defect location (row and column). Consequently, the study also looked into Fault Detection, Classification and Prediction (FDC+P) of clamping finger wear and tear rate corresponding to Lot Run Yield and Clamping Touch Down.