Reconfigurable Optical Wireless Switches for On-Chip Interconnection

Optical Wireless Networks on- Chip have been recently proposed as alternative paradigm to overcome the communication bottleneck in computing architectures based on electrical networks. In this paper, we propose the design of a $3\times 3$ switching matrix for optical wireless on- chip interconnection. The design exploits integrated optical phased arrays to guarantee the communication among three transmitters and three receivers. In this work, the effect of multipath propagation in the on- chip multi-layer structure is taken into account, and the impact of the cladding layer thickness is evaluated. The proposed device is intended to interconnect multiple nodes assuring reconfigurability and high bandwidth.