Reduction of Temperature in Layered Structure of Transceiver by Heat Conduction through Thermal Simulation

Transceivers consist of electronic and photonic components developed on silicon-on-insulator (SOI) technology. During operation, the device heats up due to the temperature sensitivity of the photonics components, and the device temperature rises. To keep the device cool, heat must be transferred from source to sink at a faster rate. In this research, by using conduction of heat through thermal simulation, rate of heat transfer from source to sink is increased. The temperature per heat power supplied to the laser decreases from 2.0 K /mW to 1.7 K/ mW by decreasing the thickness of the thermal interface material (TIM) having low thermal conductivity.