Thermal modelling of embedded microscale channel structures realized in heterogeneous packaging

With the continuous scale down and integration, more and more sophisticated packaging technologies are being developed to overcome the technology barriers in order to increase efficiency and computational power. However, with new packaging technologies, the same thermal-related problems still occur, but novel concepts can be examined to increase the heat transfer efficiency. In our paper, we present an idea to enhance the heat transfer in heterogeneous packages by integrating microscale channels into the silicon interposer, using them as a fluid cooling vehicles. As an introduction to the concept, a test vehicle is modelled in a CFD simulation tool to investigate the heat transfer efficiency under different fluid flow rates. In addition, a comparison is also made with a conventional heat sink cooling assembly.