Abstract:
Applications of power electronics that integrate high-switching isolated gate drivers in switch mode power converters create excessive transient di/dt and dv/dt loops tha...Show MoreMetadata
Abstract:
Applications of power electronics that integrate high-switching isolated gate drivers in switch mode power converters create excessive transient di/dt and dv/dt loops that exacerbate electromagnetic emissions. In this work, we developed a robust system-level coupled circuit-to-electromagnetic modeling and analysis methodology to predict the CISPR 25 radiated emission performance of a reinforced isolated switch driver during product development. The coupled method accurately captures the electromagnetic interactions between the nonlinear time-variant switchers and the system. Preliminary silicon validation measurements on an automotive high-switching isolated switch driver with an integrated power supply are presented to validate the integrity of the predictive modeling methodology. In an EMC pre-compliance lab, good correlations between modeling and measurements are achieved (i.e., within +/- 3dB for resonant peaks within the frequency band of 30MHz − 1GHz). The predictive EMC modeling methodology can be implemented to assess the performance of the initial silicon design during early IC development.
Published in: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Date of Conference: 09-12 October 2022
Date Added to IEEE Xplore: 22 November 2022
ISBN Information: