Simulation Analysis of The Optimal Process Parameters of Surface Mount Capacitor

As an energy storage component, capacitor is widely used in the field of aerospace. Surface mounted capacitor has the characteristics of small volume and easy to automatic assembly. But it is extremely sensitive to mechanical stress and thermal stress, failing frequently in the harsh environment of aerospace. In this paper, we used the steady-state thermal module and static structure module of ANSYS to carry out the thermal simulation and vibration simulation analysis of tantalum capacitor, and the maximum and minimum stress under different solder joint process parameters were obtained. Based on the simulation results, the thermal fatigue life of solder joint was calculated by Darveaux fatigue model, and the vibration fatigue life of the solder joint was evaluated by S-N double logarithm vibration fatigue curve. The highest life of solder joint was selected as the optimal combination of solder joint process parameters. In this paper, the optimal solder joint process parameters of tantalum capacitors were analyzed, which can guide the improvement of capacitor assembly process.