Fabrication of Tungsten-based Insulation Films by Inkjet Printing and Laser Sintering

High temperature thin-film sensors (HTTSs) have attracted widespread attention due to their capability to provide high-precision measurements of multiple physical parameters in harsh environments. HTTSs are often prepared on high-temperature alloy builds. Insulation films need to be processed between the substrate and the sensor to prevent the conductive substrate from affecting the sensor accuracy. Materials for insulating thin films currently are predominantly insulating ceramics such as alumina and zirconia. However, limited by the brittleness and low optical absorbance of these ceramic materials, the films can only be annealed at high temperature in a resistance furnace, which imposes great limitations on processing efficiency and substrate size. In this paper, a new approach to the rapid preparation of insulation films by ink-jet printing and laser sintering on tungsten nanoparticles (W NPs) was proposed. Insulation films of resistance
$\boldsymbol{ > 200\mathrm{M}\Omega/\text{cm}}$
and an adhesive capacity of 5B are produced by laser sintering at an energy density of 60 J/mm
²
on
$\boldsymbol{7-\mu \mathrm{m}}$
-thick inkjet-printed tungsten nanofilms.