Electrochemical migration investigation on SAC alloys incorporated by TiO2 nanoparticles in NaCl solution

The impact of the incorporation of Ti0
2
nanoparticles with different weight percentages on the electrochemical migration (ECM) behavior of SAC305 solder alloy was investigated using water drop (WD) tests in 0.1 M NaCl solution electrolyte at 10 VDC bias voltage. The outcomes of the WD test revealed higher Mean-Time-To-Failure (MTTF) for SAC305 solders including TiO
2
nanoparticles compared to SAC305. Scanning electron microscopy and energy dispersive spectroscopy (SEM-EDS) methods were further executed to investigate the morphology and chemical composition of the dendrites and residues for composite solders including TiO
2
nanoparticles which showed tree-like and fishbone-like structures for SAC305-0.1% TiO
2
and SAC305-1% TiO
2
respectively, Sn was the main element in the dendrites in both cases.