Packaging Platform for low to medium Power Packages

In recent years, the molding process gains more and more interest for encapsulation of power related packages. Main driver for the observed trend is the possibility to design very compact packages, offering an improved heat transfer compared to silicone-potted modules with only one thermal path. Present paper describes a platform approach for convenient encapsulation of power devices with epoxy-based encapsulants by Compression Molding, allowing encapsulation of different package designs with only one molding tool. Today, Compression Molding is widely used as encapsulation process of bare dies; present packaging approach shows successful encapsulation of a broader component variety. Present paper addresses process-and application-related requirements for the encapsulation material of power devices.