Reactive Anisotropic Conductive Adhesive Wafer Bonding for Solar Cells

Integration of dissimilar materials is an important technology for future space solar cells. Adhesive bonding is used to integrate dissimilar materials while widely spaced, reactive conducting particles are used to achieve electrical conduction. Indium is shown to be highly reactive with Au leading to alloyed junctions. This reactive anisotropic conducting adhesive structure reliably achieves low resistance III-V and Si bonded structures with low bow and without cracking.