Sub 0.2 /spl mu/m lithography on 300 mm wafer

We study the performance of the current 300mm lithography tool set for sub 0.2 /spl mu/m processes. The results are discussed in terms of process capability and stability. It was determined that the non-linear errors which are much higher on 300 mm wafers than on 200 mm wafers had an influence, and this is discussed in detail. We determine the root causes for the stronger appearance of these effects and propose solutions to improve the overlay performance.