3D EM Multi-technology simulation flow for GaN and RF-SOI heterogeneous integration technique

This paper presents a novel 3D EM multi-technology simulation flow applied to the Micro-Transfer Printing (MTP) heterogeneous integration technique between GaN and RF-SOI. A modular approach is proposed which relies on the two technology PDKs, the definition of a Cu-RDL technology and an assembly library. This flow addresses the intricate nature of the conformal RDL between the two technologies. Additionally, it offers a complete traceability, physical verification as well as EM simulation environment. The flow is verified with two MTP demonstrators, a CPW transmission line and a DC-6GHz SPDT switch. A good hardware/model correlation is observed which validate the proposed flow.