Electrochemical Study on Electroless Cu-Ni-P Alloy

In the present work, the process of electroless deposition of Cu-Ni-P alloy layers using liner sweep voltammetry has been studied. The influence of temperature, pH of the electrolyte, as well as the concentration of nickel ions (in the form of NiSO
4
) and the reducer (NaH
2
PO
2
) on the cathodic reduction of copper and nickel and the anodic oxidation of the reducer was studied.