Application of B-Scan for identification of delamination in Integrated Circuits

In this paper the application of B-Scan mode of surface acoustic microscopy for detection of delamination is investigated. Delamination is a common defect found in integrated circuits. It consists of presence of air cavities between layers in encapsulated integrated circuits. B-Scan is a technique for vertical inspection of the layers composing the device under test. The use of B-Scan mode to unambiguous identify the presence or absence of delamination is examined in details. The results are verified by A-Scan and 180°-phase shift of the reflected signal.