Electroless and Electrochemical Copper Deposition to Form a Conductive Layer on Anodized Aluminum Substrate

In the present work, the possibility of electroless deposition of copper layers on nanoporous anodic alumina oxide on an aluminum base has been studied. For this purpose, a weakly acidic copper electrolyte was used for electroless deposition at pH values from 4.1 to 6.1. The copper layers are thickened by electrochemical deposition of copper. The thickness, uniformity along the length of the samples and the sheet resistance on the obtained layers were measured.