Novel Approach to Display Failure on OLED Display Device

A novel failure analysis (FA) method was developed for the identification of failure root cause in a display device. Conventionally, FA on display failure requires the components to be detached from the integrated display device, which involves potentially destructive steps. These may result in an alteration of the defect, preventing a precise localization and further analysis of the failure root cause of display failure. To overcome this issue, a specific FA workflow involving in-place analysis was developed. It enabled a successful localization and characterization of the defect via emission analysis from both sides of the device and cross-sectional analysis. With this new workflow, the manufacturing step responsible for the defect was well identified. This makes FA result of display failure clearer enough to give feedback to manufacturing line for process rectification.