Heterogeneous Integration at Scale

Key challenges of on‐chip integration, including limited scalability, high cost, difficulty to maintain profitable yield, and increased thermal management complexity, suggest that additional avenues for scaling should be explored. Ultra‐large scale heterogeneous integration platforms support novel applications at improved performance. A comprehensive review of different aspects related to such integration is provided in this chapter, including fabrication, design and architecture, and reliability and testing challenges. Furthermore, some ultra‐large applications of interest are discussed. The silicon interconnect fabric, a wafer‐scale high‐performance heterogeneous integration platform is introduced and compared to other state‐of‐the‐art packaging technologies. Finally, an outlook on the future of heterogeneous integration and the benefits that the community stands to gain from this approach is provided.