High-Pixel-Density 960 × 540 Flip-Chip AlGaInP Red MicroLED Display

This article reports the active matrix (AM) 630-nm red flip-chip
$960\times540$
micro-light-emitting diode (MicroLED) displays with high pixels per inch (PPI) of 1600. A novel p-side-up AlGaInP thin-film structure by a wafer-transfer technique onto the sapphire substrate is proposed to fabricate the
$960\times540$
MicroLED array. In addition, the single pixel with a diameter of
$10~\mu \text{m}$
on the MicroLED array exhibits excellent characteristics, including a forward voltage of 1.96 V at
$17.4~\mu \text{A}$
, an extremely low leakage current of 90 fA at −10 V, and a high light output power of
$94~\mu \text{W}$
at 1 mA. The highest external quantum efficiency (EQE) is 5.3% at 330 A/cm2 for the single pixel of MicroLED. The operability and lightening pixels of flip-chip bonding to AM driver IC analyzed by software image J are 80.21% and 415 808, respectively. Through flip-chip bonding technology, the
$960\times540$
MicroLED display can demonstrate the high-resolution graphic and video images. It is a prospective technology for the application of augmented and virtual realities (AR and VR) and optogenetic neural stimulation.