Inclusion of RC compact models of packages into board level thermal simulation tools

The paper presents an algorithm and a methodology for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables correct detailed consideration of the heat transfers in the board, and in addition the calculation of the exact junction temperatures in the packages. The methodology offers the possibility of considering individual heat transfer coefficients for each package, or even to each side of the package, depending on the compact models, and on user requirements. The main advantage is that the methodology keeps the extreme speed and user friendliness of the board level solvers.