Integration of a CMOS LSI Chiplet into Micro Flexible Devices for Remote Electrostatic Actuation

In this paper, we proposed an integration method of a mm-scale high voltage (HV) driver and electrostatic actuators on a Parylene-C flexible substrate. With our unique three-layer metal structure (Cr/Au/Cr), we have demonstrated the contamination-less integration of an HV driver made of deep trench separated series silicon P-N junctions, bonded on the gold electrodes of the actuator. This technique enables CMOS LSI chips to directly be integrated with flexible electronics. Thus, novel applications of flexible electronics in various fields will be developed with the enhanced ability of signal processing, communications, and power delivery by CMOS LSI.