Transient Liquid Phase Bond Reliability Evaluation of Die-attach for Power Module Packaging

This paper presents the low temperature and pressure-less Sn-Cu solder technology process by means of Transient Liquid Phase (TLP) diffusion phenomena for high temperature power module packaging. The Sn-Cu diffusion process is developed for bonding a large area dies and its reliability are evaluated by the bond strength and accelerated active and passive thermal cycling tests.