Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-area High-performance SOC Chip

This paper proposes a Si heat sink based jetting staggered microchannel for a large area high-performance CPU chip module, which has the advantages of good surface temperature uniformity, high heat dissipation efficiency and easiness of assembling. The Si heat sink is manufactured using the DRIE and silicon-silicon bonding processes. The thermal characteristics of assembled samples are studied. The simulation and experiment results show an improvement by combining the straight microchannel and jetting microchannels. The optimal flow rate combination of the jetting and horizontal fluids is explored. It is demonstrated that, when the power is 91 W, which corresponds to a heat flux density of 45.5 W/cm
²
, the temperature rise is 85°C and the surface temperature fluctuation is less than ± 4°C for a 1 cm
²
thermal test chip. The temperature difference of coolant between the inlet and the outlet is 9.7°C, while the power consumption taken away by the coolant is 88.3 W, which leads to a heat dissipation efficiency of 97%. This technical solution is conducive to solving the cooling challenges in applications involving a large-area high-power SOC chip.