Embedded cooling with 3D manifold for high power application to 3020W power

The thermal management of high power electronics is a serious problem thanks to developing the advanced semiconductor process and utilizing the new generation semiconductor materials. This paper designed and fabricated a thermal management system for high-power devices. The size of the system is only 45mm×45mm×5mm, and four chips with embedded microchannel were integrated into it. The experimental result shows that the system can dissipate 3020W heat power. The numerical simulation results also hint at the possibility of the thermal resistance up to 0.015 K/W at the flow rate of 1600 mL/min. This research explains the powerful potential of embedded cooling technology in high-power applications.