Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet

This paper reports a parametric study’s experimental results based on the experiments’ design. No works in the literature have investigated parametrically experimental effects on electronic component cooling by combining an impinging jet and a channel flow configuration on the cooling of electronic components. This study analyzed five parameters experimentally to enhance the cooling process using statistical techniques. Additionally, the optimal configuration determined for the conventional cooling method using only the channel flow was compared. Three parameters are associated with the geometric configuration (height of the electronic component
$h/H = 1/6, 1/3$
, 1/2, jet diameter
$D/H = 0.3, 0.4$
, 0.5 and jet-component eccentricity
$S/H = 0, 1/8$
, 1/4), and the other two are related to the fluid flow (the Reynolds number based on the channel height and mean velocity of the stream
$Re_{H}= 3410$
, 4205, 5000 and the ratio between the jet and the channel mean velocities
$U_{j}/U_{m}= 2.5$
, 3.75, 5). The results show that the main parameters are statistically significant relative to heat transfer, with
$Re_{H}$
,
$U_{j}/U_{m}$
and
$h/H$
displaying the most significant amplitude of variation in response and increasing the Nusselt number by approximately 60%. The surface response models have shown a satisfactory fit with the experimental data, allowing, in a preliminary way, the minimum mechanical energy loss requirement to be identified to maximize up to 160% of the heat transfer. Specifically, the heat transfer enhancement is more significant for components of considerable height than other components. Heat transfer enhancement occurs at low mechanical energy loss when the velocity ratio decreases at the minimum channel Reynolds number at the maximum jet diameter and jet-component eccentricity.