Measurement and Analysis of the Peel Strength for Solder Joints in LGA Electronic Assembly Using Statistical Methods

This work examines the strength of solders after LGA (Land grid array) soldering. The strength of the solders is evaluated with the maximum breaking strength. The methodology for measuring the breaking force and the implementation of the intelligent measuring system for this are presented herein. With the application of intelligent measuring systems and the use of machine learning, results have been obtained that meet the specification of the studied process. The results obtained by statistical processing are analyzed. An assessment has been made in terms of a specific application. Conclusions are drawn on the basis of the obtained results and future work for stabilization and guarantee of the soldering process with Hot bar is considered.