Electroless Deposition of Cu-Ni-P Alloy Coatings on a Dielectric Surface for Application in Electronic

The present work investigates the impact of the concentration of nickel sulfate and the thickness of electroless deposited Cu-Ni-P alloy coatings on their uniformity. The obtained alloy coatings are compared with electroless deposited copper and nickel coatings. The following methods were used to study the morphology, structure and deposition rate of the obtained layers: atomic force microscopy and X-ray fluorescence analysis, as well adhesion, roughness and sheet resistance were measured. The resulting alloy coatings are characterized by good uniformity and are suitable to replace conventional electrolytes for use in electronics application.