Study on Thermal Compensation Treatment Method of Strain Measured by Resistance Strain Gauge Method in Reflow Soldering Process

Accurate measurement of strain in PCB assembly process is the basis for establishing process baseline and ensuring the manufacturing reliability of electronic products. The strain in PCB assembly process mainly includes mechanical strain and thermal/mechanical strain. Reflow soldering process is one of the most common thermal/mechanical strain operation processes in PCB assembly. In this paper, the strain of reflow soldering process is measured by resistance strain gauge method, and two technical methods are used for thermal compensation treatment. Based on the comparative analysis of multiple groups of strain data and the strain measured by strain gauge method and TMA method, the applicable thermal compensation method of the current test system is optimized, which provides a technical reference for the thermal strain compensation treatment of reflow soldering.