Mold filling Simulation analysis and improvement of 5G PA module on SIP package

Domestic RF chips have gone through 2G PA and 3G PA, and are shifting from 4G PA to 5G PA. With the development of 5G technology, PA products are becoming more and more integrated. High-density FC chips with different functions and passive components with different sizes make SIP package more and more difficult. Higher requirements are need for package technology, especially for mold process capability.This paper mainly studies mold filling defect of 5G PA products based on SIP package. A large number of chips and components of different sizes are integrated into the SIP package, so it is high risk to cause package reliability problems due to compound void in the process of molding. In this study, the advanced 3D flow simulation software MOLDX 3D is used to simulate the mold filling process of SIP package. Simulation results are compared with the experimental findings, Comparison shows good agreement. The results show that for SIP package with multi-chip and multi- components, optimizing the package design and parameters related to mold can minimize the risk of void issues caused by the mold filling stage, high reliability of 5G PA module on SIP package is guaranteed.