Research on design and fabrication of ceramic package for magnetoresistive random access memory

Based on high temperature co-fired ceramic technology, a ceramic package for encapsulating magnetoresistive random access memory was designed and fabricated, and its packaging form was 8-wire CSOP (ceramic small outline package). The research content includes optimizing each structural component of the ceramic package, and analyzing the influence of different metal materials on the magnetic shielding efficiency through electromagnetic simulation software. The research shows that adding metal layer in the middle of the multilayer ceramic material and optimizing the structure of the ceramic package can improve the magnetic shielding efficiency of the ceramic package. Finally, the magnetic shielding efficiency of the prepared package is tested. The magnetic shielding efficiency of the optimized ceramic package was increased from 39% to 58%. The test results were in good agreement with the simulation. It is proved that the above method can effectively guide the structural design of this type of ceramic package. and a new ceramic package for encapsulating magnetoresistive random access memory is proposed.