The serving behavior of nanotwinned copper under the reliability test of high temperature high humidity and electromigration test

Copper is widely used in electronic packaging and other fields due to its good electrical and thermal conductivity and mechanical properties. With the rapid development of electronics, electric power, aerospace and machinery in recent years, the service conditions of electronic components are becoming more and more severe. Traditional copper has problems such as insufficient strength and poor thermal stability. In this study, a reliability comparison between nanotwinned copper (NT-Cu) and commercial traditional equiaxed copper (CE-Cu) under high temperature high humidity and electromigration test was performed. Specifically, we prepared wafer coupons with patterns, and used scanning electron microscopy (SEM) to characterize the microstructure evolution and failure modes during high temperature and high humidity test. It showed that the reliability of NT-Cu was significantly better than CE-Cu in corrosion resistance. In addition, the electromigration (EM) test was also conducted on these two kinds of copper films. The lifetime of NT-Cu was about 1.5 times higher than that of traditional CE-Cu for EM test. As revealed by the microstructure observation, the anti-electromigration performance of NT-Cu was also better than CE-Cu.