Forward design research on the warpage of baseplate for IGBT module

The IGBT module is characterized as a multi-layer composite structure. Due to the large difference in the coefficients of thermal expansion among the materials in the module, different structures have distinctive thermal expansion and cooling shrinkage in the process of intense temperature change during the packaging process, resulting in internal stress in the module and warpage of the baseplate. The warpage of the baseplate will not only detrimentally reduce the heat dissipation efficiency of the module, but also render the ceramic of the substrate to bear greater stress and cause brittle fracture of the ceramic. In this paper, the warpage of baseplate in the packaging process is positively designed from the point of view of overall structural design.. Firstly, the combination of material and structural parameters that minimize the baseplate deformation is obtained through simulation. Then, reverse deformation is pre-set for the raw material of the baseplate, so as to compensate the deformation of the baseplate during the packaging process, and further reduce the warpage value of baseplate in the finished module. Through the forward design of the baseplate warpage, the baseplate deformation in the packaging process is effectively reducedand the baseplate warpage value of the finished module is minimized, which plays an important guiding role in the development of IGBT module.