Research on Optimization of Gold Wire Bonding Process between Gold-Plated Quartz Glass Electrode and Metal Base

The optimization study of gold wire bonding process between quartz glass gold-plated electrodes and metal base pins was carried out by partial factorial DOE method. The multiple linear regression equation corresponding to the bond tension value and the influence factor was obtained by regression fitting. The study found that the significant degree of influence of the bonding parameters on the bonding tension value was in the following order: ultrasonic time>bonding pressure>bonding temperature>ultrasonic power. The optimized parameter combination was as follows: the ultrasonic power was 100mW, the ultrasonic time was 25ms, the bonding pressure was 25cN, and the bonding temperature was 150℃. The ultrasonic power had a significant interaction with the bonding temperature. When the bonding temperature was at a low level, the bonding tension value increased with the increase of the ultrasonic power. When the bonding temperature was at a high level, the bond tension value decreased with the increase of the ultrasonic power. After verification, the bonding tension was greatly improved using the optimized bonding process parameters.