Effect of Surface Treatment on Bonding Performance of Devices to Printed Circuit Board

In order to enhance the environmental applicability of devices, adhesives are often used to reinforce devices in the electronic industry, and the bonding strength is closely related to the surface structure state of the adhesives. In this paper, the surface treatment methods of printed circuit boards, SOP and BGA devices are studied, and the surface tension is measured with dyne test pens. It is found that both chemical reagents and plasma treatment can improve the bonding performance of printed circuit boards and parts. After treatment, the surface dyne value can reach 44, the peeling failure form is cohesive destruction, and the interface bonding strength is higher than the body strength of the adhesive, which can meet the performance.