High density 3D heterogeneous integration used in microwave modules

High density 3D heterogeneous integration technology used in electronic equipment microwave modules was studied in the paper，high aspect ratio through silicon via (TSV) function interposer preparation, high precision wafer level flip chip, high reliable fan-out package, Si interposer hermetic bonding were researched in detail. High density 3D heterogeneous integration samples were manufactured. The results indicate that through silicon via (TSV) function interposer was made by deep via etching, copper plating hole filing and surface re-distribution layer (RDL), high reliable chip to wafer (C2W) flip chip was made by bump preparation and flip chip technology , fan-out packaging was made by high precision die thinning, bump preparing and high reliable plastic packaging technology, high precision interposer hermetic bonding was made by high precision pre-alignment of wafer lever bonding, and wafer level hermetic bonding technology. The paper supplies technology reference to high density 3D heterogeneous integration used in electronic equipment microwave module.