A Process Design Method for Multichip Module using Model Based Definition

Benefit from high performance, high integration density, high heat dissipation and relatively low cost, the application of MCM (multichip module) has spread from military, aerospace and mainframe computers to electronic system products such as automobiles, communications, industrial devices, instruments and medical equipment. However, unlike chip design or PCB design, there is no mature design method for MCM based on model. 2D drawing-based design software, such as AutoCAD, are still using for MCM design. Thus, the design file doesn’t include sufficient manufacturing data for process design, such as manufacturability check and process flow design. In order to improve the actual efficiency and accuracy of the process design, a method based on model-based definition was approved. This method is applied in Allegro SiP Layout design platform and realized by secondary development using SKILL command language. Through this method, a 3D model of MCM, which contains geometric dimension, cross-section of substrate, bill of materials (BOM), die type, bond wire and other definitive manufacturing data, is designed. With this model, an assembly manufacturability check, which evaluates the manufacturability and producibility of design model, can be applied along with designing. Then, a process flow design scheme, which includes the allocation of BOM, is generated using this design model. According to the test results of process design of MCM, this method was benefit for reducing design error, reducing reliance on manual experience, improving the automation of process design, and resulted in faster feedback loops, better decisions, and faster-to-market products.