Design of Three-layer Glass-based 3D Stacked Radio Frequency Transmission Structure

Multi-function, high performance and miniaturization are the eternal development trend of electronic information systems. The glass substrate has high-density wiring and micro-hole processing capabilities, as well as excellent broadband radio frequency transmission performance, as an important basic material for heterogeneous integrate, it has received great attention in the industry. Glass is a rich material system. At the same time, stud bumps are used for interconnection between chips, interposer, and substrate. Which are used This paper studies the simulation design of a three-dimensional stacked RF transmission structure based on a glass adapter plate, and on this basis, a glass-based three-dimensional stacked sample is formed for testing. The fully parametric three-layer glass stacked RF transmission structure simulation model contains both the horizontal transition structure and the vertical transition structure. Finally, we measured the electrical performances of the three-layer glass stacked RF transmission structure by vector network analyzer and probe bench for insertion loss (S21) and voltage standing wave ratio (VSWR) responses. The measurement results show that the electrical performance of the three-layer glass stacked RF transmission structure meets the application over the frequency range of DC-40GHz with low insertion loss (|S21| < -0.738dB @20GHz; |S21| < -1.574dB @40GHz) and low VSWR (VSWR < 1.264 @DC-36GHz; VSWR < 1.668 @36-40GHz).