A Novel Micro-channel Package Based on Stress Cushioning of Ceramic Interlayer

In this paper, the thermal failure of the new micro-channel package is studied, and the ceramic substrate is used as the stress buffer layer between the silicon micro-channel and the metal structure to realize the highly reliable encapsulation of micro-channel heat dissipation structure. Integration of micro-channel cooling technology can solve the problem of high power chip heat dissipation, on the other hand it is also compatible with 3D integrated systems encapsulation, but due to the silicon with external metal structure between the lager thermal mismatch, lead to many engineering application problems, including welding thermal stress between micro-channel and metal structure, reliability of micro-channel to external metal interface. This article explores the high thermal conductivity ceramic base slabs stress cushion structure and micro flow channel, and optimize the structure of metal materials, sizes , parameters, such as the structure size is obtained by finite element simulation analysis on its packaging stress, assembling and verify the feasibility of the technology scheme, which can realize 50 × 50 mm of silicon micro flow channel and metal structure large structure interconnection. The relevant research results can guide the application of similar packaging and reduce the reliability risk.