Thin and Flexible Silver/Polymer Composite Film based on Metal-Organic Decomposition for High-performance EMI Shielding in Electronic Packaging Application

Conductive polymer composites with excellent electrical conductivity have attracted worldwide attention in the field of electromagnetic interference (EMI) shielding. In this work, we fabricated a thin and flexible silver/poly(styrene-block-butadiene-block-styrene) composite (Ag/SBS) film by drop-coating of metal-organic decomposition (MOD) on SBS film substrate with plasma treatment, and followed by sintering process at low temperature. It is found that the EMI SE of Ag/SBS film with Ag layer thickness of ~ 1 µm achieves 60 dB due to the effective reduction of MOD and compact structure of Ag after sintering at 160
^o
C. Moreover, benefiting from the thermoplastic elastomer characteristics of SBS and strong interaction between Ag and SBS, there is no obvious effect on the EMI SE of Ag/SBS film after 50 cycles of stretching with 10% tensile strain. In addition, the Ag/SBS film shows remarkable near-field shielding characteristic of over 30 dB in the frequency range of 1 - 6 GHz, which demonstrates the potential application of Ag/SBS film in electronic packaging. This work provides easy processing, low cost and good mechanical flexibility polymer composites for high-performance EMI shielding.