A MMC-type FID Submodule Open-Circuit Fault Detection and Localization Strategy Based on Maximal Information Coefficient

Modular multilevel converter (MMC) is a common low and medium voltage flexible interconnection device (FID), because of its modularity, scalability, and multi-electricity level. When an IGBT open-circuit fault occurs in a sub-module, there will be inconsistency between the actual and predicted currents, which eventually leads to a large difference of the capacitance voltage between the faulty sub-module and the normal sub-module. In response to the above problems, this paper proposes a MMC Submodule open-circuit fault detection and localization strategy based on maximal information coefficient. This method is adapted to multiple submodules IGBT open-circuit fault cases and can quickly locate the faulty submodule less than 20ms. Finally, the effectiveness of the method in this paper is verified by the Matlab simulation model.