On Superior Power Cycling capability of a High Power Density SiC Power Module for e-Mobility Application

In this paper, the power cycling (PC) capability of RoadPak half-bridge SiC power modules is presented and the reliability fulfilment of the RoadPak power module for challenging e-Mobility mission profiles is assessed. The outstanding power cycling outcome has consolidated the competitiveness of the SiC-based RoadPak module backboned by the advanced packaging solutions. The failure mode analysis after PCmin and PCsec shed light how advanced packaging system of RoadPak enables the full extraction of the power of SiC devices at elevated junction temperatures. Predicted RoadPak lifetime model is proposed with prudence yet fully sufficing harsh requirement. Furthermore, the challenges related to PC testing of SiC-based modules are discussed.