Dishing Improve in Advanced Technology Nodes

As the semiconductor manufacturing process enters the FinFET node, the process window becomes narrower, and the requirements for the uniformity of chemical mechanical polishing (CMP) become higher, by which the negative effects brought are also unrestricted reduced. As one of the main side effect of CMP, the request of dishing is much stricter in advanced technology. The paper analyzes the causes of dishing, and introduces the control methods of dishing from three aspects: control before dishing generates, optimization during dishing and improvement after dishing exists. Finally, it should be pointed out that the successful stringing of advanced technology requires the coordination and integration of all modules. Only through joint cooperation can the process window be broadened and a win-win situation is achieved.