Preparation of biological micro powder based epoxy composite with improved damping factor and investigation for application in a MEMS sensor packaging

In the presented work stiffness and damping properties of eggshell based epoxy composites is investigated. Ingredients used for preparation of the composite includes 25-45 µm sized egg shell powder, PolyDiMethylSiloxane (PDMS), hardener, and coupling agent. Influence of micro-powder and coupling agent proportion on vibration properties of the epoxy composite is investigated. Experimentation on the prototype samples has been conducted using an impact hammer, accelerometer and Fast Fourier Transform (FFT) analyser, to investigate the influence of the micro powder addition on damping factor and stiffness of the composite. The study reveals that there is up to 201% improvement in the damping factor with 2.5% addition of the micro powder by weight and there is no significant effect on stiffness of the composite. A case study is demonstrated with use of the proposed epoxy composite for a MEMS sensor packaging which shows up to 20 % reduction in acceleration transmissibility in comparison to that of use of conventional epoxy being used or the sensor packaging.