A novel low-loss wafer-level packaging of the RF-MEMS devices

In this work, the flip-chip method was used for packaging an RF-MEMS switch on a quartz substrate with low losses. 4-inch Pyrex glass was used as a package substrate and was airblast punched with 250 /spl mu/m diameter holes. A Cr/Au seed layer was deposited on it and the vias were filled by plating with gold. After forming molds on the holes with thick photoresist, bumps were plated on holes. The package substrate was bonded with a quartz substrate using B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of both RF-MEMS and other MEMS devices.